Industrial Fiber Laser Marking Machine
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2.5D Fiber Laser Marking Machine
HRC-FP series laser marker adopts advanced digital high-speed scan galvanometer and Module design that separate laser generator and lifter, endowed with the qualities of small volume, quick speed and easily marking on the big objects surface.
2.5D fiber laser marking engraving machine is an upgraded system based on 2D laser, using special marking software for laser marking to perform a deep marking on the surface of metal material to achieve relief or deep engraving effect.
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Factory Price Of 20w Laser Marking Machine
The fiber laser engraving machine adopts most advanced Germany technology and the fiber laser source lifetime can reach 100,000 hours, 8-10 years without any consumables and maintenance.
The fiber laser engraving machine is the best choice for the customers who have special requirements to the smallest & finest laser beam and character. According to its many features, people also call it fiber laser engraving machine, metal laser engraving machine, metal laser marking machine, laser metal engraving machine, laser engraving machine metal.
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Laser Marking Machine for Metal
The fiber laser engraving machine adopts most advanced Germany technology and the fiber laser source lifetime can reach 100,000 hours, 8-10 years without any consumables and maintenance.
The fiber laser engraving machine is the best choice for the customers who have special requirements to the smallest & finest laser beam and character. According to its many features, people also call it fiber laser engraving machine, metal laser engraving machine, metal laser marking machine, laser metal engraving machine, laser engraving machine metal.
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UV Laser Marking Machine
Ultraviolet laser marking machine belongs to a series of laser processing technology. It uses 355nm UV laser as the light source. The machine uses third-order intracavity frequency doubling technology to compare with infrared laser (pulsed fiber laser), 355 ultraviolet focusing spot. Small, can greatly reduce the mechanical deformation of the material and has little influence on the processing heat, because it is mainly used for superfine marking, engraving, cutting.
It is especially suitable for applications such as marking of food and pharmaceutical packaging materials, micropores, high-speed division of glass materials, and complex graphic cutting of wafer wafers.
