Ultraviolet laser marking machine belongs to a series of laser processing technology. It uses 355nm UV laser as the light source. The machine uses third-order intracavity frequency doubling technology to compare with infrared laser (pulsed fiber laser), 355 ultraviolet focusing spot. Small, can greatly reduce the mechanical deformation of the material and has little influence on the processing heat, because it is mainly used for superfine marking, engraving, cutting.
It is especially suitable for applications such as marking of food and pharmaceutical packaging materials, micropores, high-speed division of glass materials, and complex graphic cutting of wafer wafers.